Eminence Business Media

Eminence Business Media

Friday, November 18, 2011

Shanghai prepares for Labelexpo Asia 2011


Labelexpo Asia 2011 returns to the Shanghai New International Expo Centre (SNIEC) from November 29 to December 2. With over 250 exhibitors and countless live machinery demonstrations, the show aims to beat 2009’s record of 16,601 visitors.

Complementing the exhibition, Labelexpo Asia 2011 also features an educational conference program where visitors will hear from high profile speakers, key suppliers and learn from a series of customer case studies.

The keynote presentation, including an overview of latest developments and market forecasts, will be made by Jouko Lähepelto, senior vice president, Americas and Asia Pacific at UPM Raflatac. Dean Scarborough, chairman of Avery Dennison, will look at next generation materials and future trends in China, while Christian Menegon, business development manager at Hewlett-Packard, will focus on the value of digital technology.

Peter Wang, regional sales manager, Asia Pacific at DuPont, will highlight customer case studies where long-term anti-counterfeiting systems have been developed. Dr Zhangshui Gong, chief engineer at Hangzhou Toka Ink Chemical Co, will explore the technical trends for inks in China and Federico d’Annunzio, managing director of Gidue, will examine the opportunities for label printers in package printing.

Roger Pellow, Labelexpo managing director, said: ‘As the third biggest player in the global market, the Chinese label industry is continuing to go from strength to strength. As the region’s largest event, we’re certain we can build on the success of 2009’s exhibition with even higher visitor and exhibitor figures. With the Asian industry experiencing such vigorous growth and diversification, it is pivotal that we again provide printers and manufacturers with the perfect platform to do business, learn about the latest advances in technology and applications and hear about ways in which they can maximize profits while driving down costs.’